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Packaging Engineer I Semiconductors

At Capgemini Engineering, the world leader in engineering services, we bring together a global team of engineers, scientists, and architects to help the world’s most innovative companies unleash their potential. From autonomous cars to life-saving robots, our digital and software technology experts think outside the box as they provide unique R&D and engineering services across all industries. Join us for a career full of opportunities. Where you can make a difference. Where no two days are the same.

YOUR ROLE

 

As a Packaging Engineer, you will be responsible for designing and optimising IC packages for semiconductor applications, working closely with customers and suppliers to deliver high-performance solutions. In this role you will play a key role in:

 

  • Selecting and designing appropriate IC package types based on client specifications and IC requirements, including expertise in 2.5D/3D packaging and backend silicon layout
  • Performing comprehensive signal integrity (SI) and power integrity (PI) simulations and electrical analysis to identify limitations and potential issues early in the design process
  • Optimising electrical performance of IC packages by analysing routing, parasitic effects, noise, and electromagnetic compatibility (EMC), proposing design enhancements where needed
  • Reviewing designs for manufacturability and cost optimisation, ensuring compatibility with manufacturing processes, assembly requirements, and material availability
  • Producing detailed technical reports summarising analysis, simulations, design modifications, and optimisation recommendations, clearly communicating findings to customers and suppliers

YOUR PROFILE

 

  • An MSc in Electronics Engineering or equivalent, combined with a minimum of 5 years of experience in IC package design and SI/PI analysis
  • Hands-on experience with Cadence layout tools for package and backend silicon design, including place & route
  • Proficiency in Ansys simulation tools for electrical and electromagnetic performance analysis
  • Strong knowledge of 2.5D/3D packaging technologies and an understanding of the full IC package design lifecycle, from concept through to manufacturing
  • Excellent communication skills in English (written and spoken)



Capgemini is a global business and technology transformation partner, helping organizations to accelerate their dual transition to a digital and sustainable world, while creating tangible impact for enterprises and society. It is a responsible and diverse group of 340,000 team members in more than 50 countries. With its strong over 55-year heritage, Capgemini is trusted by its clients to unlock the value of technology to address the entire breadth of their business needs. It delivers end-to-end services and solutions leveraging strengths from strategy and design to engineering, all fuelled by its market leading capabilities in AI, cloud and data, combined with its deep industry expertise and partner ecosystem. The Group reported 2023 global revenues of €22.5 billion. 
Ref. code:  476849
Posted on:  12 May 2026
Experience Level:  Experienced Professionals
Contract Type:  Permanent
Location: 

Diegem, BE

Brand:  Capgemini Engineering
Professional Community:  Products & Systems Engineering

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